View HT46R01T3_40878.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

www..com
HT46R01T3/ HT48R01T3 8-Bit OTP MCU with RF Transmitter
Features
MCU Features
* MCU Operating voltage: * Bit manipulation instruction * Low voltage reset function * 16-pin NSOP package type * Up to 8 bidirectional I/O lines * 4 channel 12-bit ADC * 1 channel 8-bit PWM * External interrupt input shared with an I/O line * Two 8-bit programmable Timer/Event Counter with
fSYS= 4MHz: 2.2V~3.6V fSYS= 8MHz: 3.0V~3.6V
* Power Down modes and wake-up functions to re-
duce power consumption * Oscillator types - External high frequency Crystal - External RC - Internal RC - External low frequency crystal - Watchdog Timer Internal RC Oscillator
* Three operational modes: Normal, Slow, Sleep * Fully integrated internal 4MHz, 8MHz oscillator
overflow interrupt and prescaler
* Time-Base function * Programmable Frequency Divider - PFD
RF Transmitter Features
* Complete UHF ASK/OOK transmitter * Frequency range 300MHz to 450MHz * Data rates more than 10k bps * Output Power up to 10dBm * Low voltage operation - down to 2.2V * Data tracking function for power saving * Reference clock output for MCU IRC clock
requires no external components
* OTP Program Memory: 1K15 * RAM Data Memory: 968 * Watchdog Timer function * All instructions executed in one or two instruction
cycles
* Table read instructions * 63 powerful instructions * 6-level subroutine nesting
synchronisation
General Description
These devices provide a combination of a fully featured MCU plus an RF transmitter function, giving them great flexibility for use in wide range of wireless I/O control applications such as industrial control, consumer products, subsystem controllers, etc. Analog features include a multi-channel 12-bit A/D converter. Multiple and extremely flexible Timer/Event Counters provide full timing functions. Protective features such as an internal Watchdog Timer and Low Voltage Reset coupled with excellent noise immunity and ESD protection ensure that reliable operation is maintained in hostile electrical environments. An extensive choice of oscillator functions are provided including a fully integrated system oscillator which requires no external components for its implementation. The ability to operate and switch dynamically between a range of operating modes using different clock sources gives users the ability to optimise microcontroller operation and minimise power consumption. The devices also include flexible I/O programming features Time-Base functions and a range of other features. The RF transmitter is a high performance and easy to use transmitter operating in the 300MHz to 450MHz frequency band. One only needs to add a crystal reference frequency, and a limited number of external compoRev. 1.00 1 nents to create a complete and versatile RF transmitter system. The device is capable of delivering more than +9dBm into a 50W load. Such a power level enables a small form factor transmitter to operate near the maximum limit of the transmission regulations. The device can operate with ASK - Amplitude Shift Keying, and OOK - On-Off Keying, UHF receiver types from wide-band super-regenerative radios to narrow-band, high performance super-heterodyne receivers. The data rate is higher than 10kbps, allowing the device to support more complicated control protocols. For enhanced power saving, the device includes a data tracking function. The data tracking function enables the PLL to be activated as long as high transient data input trigger signals are received. The PLL will also be automatically switched off if there are no data input transients for a time exceeding approximately 300ms. As there is a reference clock input on line PB0, the MCU can use its internal RC clock rather than using an additional crystal for the system clock. These features add up to ensure that the devices can offer excellent capabilities in terms of functionality and power-saving as well as being highly cost effective in a huge range of remote wireless applications
March 1, 2010
www..com
HT46R01T3/HT48R01T3
Selection Guide
Part No. HT48R01T3 HT46R01T3 Program Data Memory Memory 1K15 1K15 968 968 I/O 9 9 8-bit Timer 2 2 Time Base 1 1 RF Transmitter O O A/D 3/4 PWM 3/4 Stack Package 6 6 16NSOP 16NSOP
12-bit4 8-bit1
Block Diagram
The following block diagram illustrates the dual-chip structure of the devices, where an individual MCU and RF Transmitter devices are combined into a single package.
V
DD
V P B 1 /D O U T
DD1
P A 0 /A N 0 P A 1 /P F D /A N 1 P A 2 /T M R 0 /A N 2 P A 3 /IN T /A N 3 P A 4 /P W M /T M R 1 P A 5 /O S C 2 P A 6 /O S C 1 P A 7 /R E S
H T46R 01B H T48R 01B PB1 PB0 D IN
H T9831 PAOUT XOUT X IN EN
CREF
VSS
VSS1
Internal Chip Interconnection Diagram Note: The PWM and AN0~AN3 shared-pin functions only exist in the HT46R01T3 device.
Low V o lta g e R eset PW M D r iv e r PFD D r iv e r RF T r a n s m itte r I/O P o rts
W a tc h d o g T im e r R eset C ir c u it 8 - b it R IS C MCU C o re In te rru p t C o n tr o lle r E x te rn a l R C /X T O s c illa to r
A /D C o n v e rte r
T im e r s
T im e B ase
In te rn a l O s c illa to r
Note: The PWM and A/D Converter functions only exist in the HT46R01T3 device.
Rev. 1.00
2
March 1, 2010
www..com
HT46R01T3/HT48R01T3
Pin Assignment
P B 1 /D O U T 1 2 3 4 5 6 7 8 P A 3 /IN T /A N 3 P A 2 /T M R 0 /A N 2 P A 1 /P F D /A N 1 P A 0 /A N 0 VSS VSS1 PAOUT 16 15 14 13 12 11 10 9 P A 4 /P W M /T M R 1 P A 5 /O S C 2 P A 6 /O S C 1 P A 7 /R E S VDD XOUT X IN VDD1 P B 1 /D O U T 1 2 3 4 5 6 7 8 P A 3 /IN T P A 2 /T M R 0 P A 1 /P F D PA0 VSS VSS1 PAOUT 16 15 14 13 12 11 10 9 P A 4 /T M R 1 P A 5 /O S C 2 P A 6 /O S C 1 P A 7 /R E S VDD XOUT X IN VDD1
H T46R 01T3 1 6 N S O P -C
H T48R 01T3 1 6 N S O P -C
Pin Description
HT46R01T3 Pin Name PA0/AN0 AN0 PA1 PA1/PFD/AN1 PFD AN1 PA2 PA2/TMR0/AN2 TC0 AN2 PA3 PA3/INT/AN3 INT AN3 PA4 PA4/TMR1/PWM TC1 PWM PA5 PA5/OSC2 OSC2 PA6 PA6/OSC1 OSC1 PA7 PA7/RES RES PB1 PB1/DOUT DOUT 3/4 3/4 Function PA0 OPT PAPU PAWK ADCR PAPU PAWK CTRL0 ADCR PAPU PAWK 3/4 ADCR PAPU PAWK 3/4 ADCR PAPU PAWK 3/4 CTRL0 PAPU PAWK CO PAPU PAWK CO PAWK CO PBPU I/T ST AN ST 3/4 AN ST ST AN ST ST AN ST ST 3/4 ST 3/4 ST OSC ST ST ST O/T Description
CMOS General purpose I/O. Register enabled pull-up and wake-up. 3/4 A/D channel 0
CMOS General purpose I/O. Register enabled pull-up and wake-up. CMOS PFD output 3/4 A/D channel 1
CMOS General purpose I/O. Register enabled pull-up and wake-up. 3/4 3/4 External Timer 0 clock input A/D channel 2
CMOS General purpose I/O. Register enabled pull-up and wake-up. 3/4 3/4 External interrupt input A/D channel 3
CMOS General purpose I/O. Register enabled pull-up and wake-up. 3/4 External Timer 1 clock input
CMOS PWM output CMOS General purpose I/O. Register enabled pull-up and wake-up. OSC Oscillator pin
CMOS General purpose I/O. Register enabled pull-up and wake-up. 3/4 3/4 Oscillator pin
NMOS General purpose I/O. Register enabled wake-up. Reset input
General purpose I/O. Register enabled pull-up. CMOS Internally connected to DIN pin on RF module. Must be setup as output for interfacing to RF module. 3/4 Data output from MCU to RF module Connected internally to PB1
Rev. 1.00
3
March 1, 2010
www..com
HT46R01T3/HT48R01T3
Pin Name PAOUT XOUT XIN VDD VSS VDD1 VSS1 Note: Function PAOUT XOUT XIN VDD VSS VDD1 VSS1 OPT 3/4 3/4 3/4 3/4 3/4 3/4 3/4 I/T 3/4 3/4 HXT PWR PWR PWR PWR O/T NSO HXT 3/4 3/4 3/4 3/4 3/4 Description RF power amplifier output RF chip crystal pin RF chip crystal pin MCU power supply MCU ground RF chip power supply RF chip ground
I/T: Input type O/T: Output type OPT: Optional by configuration option (CO) or register option PWR: Power CO: Configuration option ST: Schmitt Trigger input CMOS: CMOS output NSO: Non-standard output
HT48R01T3 Pin Name PA0 Function PA0 PA1 PA1/PFD PFD PA2 PA2/TMR0 TC0 PA3 PA3/INT INT PA4 PA4/TMR1 TC1 PA5 PA5/OSC2 OSC2 PA6 PA6/OSC1 OSC1 PA7 PA7/RES RES PB1 PB1/DOUT DOUT 3/4 3/4 CO PBPU ST ST OPT PAPU PAWK PAPU PAWK CTRL0 PAPU PAWK 3/4 PAPU PAWK 3/4 PAPU PAWK 3/4 PAPU PAWK CO PAPU PAWK CO PAWK I/T ST ST 3/4 ST ST ST ST ST ST ST 3/4 ST OSC ST O/T Description
CMOS General purpose I/O. Register enabled pull-up and wake-up. CMOS General purpose I/O. Register enabled pull-up and wake-up. CMOS PFD output CMOS General purpose I/O. Register enabled pull-up and wake-up. 3/4 External Timer 0 clock input
CMOS General purpose I/O. Register enabled pull-up and wake-up. 3/4 External interrupt input
CMOS General purpose I/O. Register enabled pull-up and wake-up. 3/4 External Timer 1 clock input
CMOS General purpose I/O. Register enabled pull-up and wake-up. OSC Oscillator pin
CMOS General purpose I/O. Register enabled pull-up and wake-up. 3/4 Oscillator pin
NMOS General purpose I/O. Register enabled wake-up. 3/4 Reset input
General purpose I/O. Register enabled pull-up. CMOS Internally connected to DIN pin on RF module. Must be setup as output for interfacing to RF module. 3/4 Data output from MCU to RF module Connected internally to PB1
Rev. 1.00
4
March 1, 2010
www..com
HT46R01T3/HT48R01T3
Pin Name PAOUT XOUT XIN VDD VSS VDD1 VSS1 Note: Function PAOUT XOUT XIN VDD VSS VDD1 VSS1 OPT 3/4 3/4 3/4 3/4 3/4 3/4 3/4 I/T 3/4 3/4 HXT PWR PWR PWR PWR O/T NSO HXT 3/4 3/4 3/4 3/4 3/4 Description RF power amplifier output RF chip crystal pin RF chip crystal pin MCU power supply MCU ground RF chip power supply RF chip ground
I/T: Input type O/T: Output type OPT: Optional by configuration option (CO) or register option PWR: Power CO: Configuration option ST: Schmitt Trigger input CMOS: CMOS output NSO: Non-standard output
Internally Connected Pins In addition to the internal connection between MCU pin, PB1, and RF Transmitter pin, DIN, the MCU pin, PB0, and RF Transmitter pin, CREF, are also internally connected. However it should be noted that PB0/CREF is not connected to any external pins on the device package. Pin Name Function OPT I/T O/T Description
PB0 PB0/CREF CREF
PBPU
ST
General Purpose I/O. Register enabled pull-high resistor. Internally connected to CREF pin on RF module. CMOS Must be setup as an input for interfacing to RF module. Not available on package. 3/4 RF Transmitter generated pulses for synchronisation. Connected internally to PB0. Not available on package.
3/4
3/4
Rev. 1.00
5
March 1, 2010
www..com
HT46R01T3/HT48R01T3
Functional Description
As these device packages contain multiple internal chips, for a detailed functional description, users must refer to the relevant individual datasheets for both the MCU and the RF Transmitter. The following table shows which individual devices are inside each package. Device HT48R01T3 HT46R01T3 MCU HT48R01B HT46R01B RF Transmitter HT9831 HT9831
* Operation
Multi-chip Internal Devices The MCU controls the RF transmitter via a two line interface using two of its I/O pins, PB0 and PB1. Pin PB1, which should be setup as an output by the MCU, is used to generate the encoding data. Pin PB0, which should be setup as an input by the MCU, is used for synchronising purposes. Although most of the functional description material will be located in the individual datasheets, there are some special considerations which need to be taken into account when using multi-chip devices. These points will be mentioned in the hardware and software consideration sections. Multi-chip Hardware Considerations As these single-package multi-chip devices are composed of an individual MCU and RF Transmitter chips, using them together requires the user to take care of some special points.
* Absolute Maximum Ratings
The Absolute Maximum Ratings for the two individual chips must be checked for discrepancies and the necessary care taken in device handling and usage.
* Power Supply
When examining the datasheet of the HT9831 RF Transmitter device, it can be seen that there is an EN pin on the device. This EN pin is not bonded out to an e xt e r n a l p i n o n t h e p a cka g e s o f t h e HT46R01T3/HT48R01T3 but is internally connected to the VSS1 ground pin. Therefore when reading the HT9831 datasheet users must take into account the permanent low state of the EN pin. The RF data to be transmitted is derived from the PB1 line. When the PB1 line is high the device will transmit allowing users to program their encoded data on this line. If the RF transmitter is in its standby mode then there will be a delay of about 500ms before transmission begins. When the device is transmitting, a synchronising signal will be generated on the CREF/PB0 pin which allows the MCU to use it to calibrate its internal RC oscillator. To avoid the RF circuits entering an unknown state, pin PB1 should be setup as an output as soon as possible after power-on. To minimise power consumption, only when PB1 is high, can the RF signal be transmitted and the reference clock on PB0 be generated. If no data transitions are generated on PB1 for 300~500ms, the transmitter will enter a standby state and the RF circuits will be switched off along with the internal PLL to save power. The signal generated on the CREF/PB0 line will also remain at a low level. The internal PLL function is used to generate the RF frequency with a multiplier of 32 times the crystal frequency. The relationship is: RF frequency = 32 Crystal frequency. Therefore a 9.84375MHz crystal will generate an RF frequency of 315MHz and a13.56MHz crystal will generate an RF frequency of 433.92MHz. All PLL circuits are contained within the device and the only external component required is a suitable crystal.
* Power Down and Wake up
Examination of the block diagram will reveal that the Power Supply and Ground pins of the RF Transmitter and MCU are independent and must be connected together if they are to share the same power supply. If the same power supply is to be used for both chips then care must be taken as both have different power supply requirements. When calculating the total current consumption of the device, the internal DC specifications of the two internal chips must be consulted and the individual currents added together.
It is important to note that if the MCU is powered down or placed into a low power mode to conserve power, that the RF Transmitter may continue running and will consume a certain amount of power. Before powering down the MCU it is important to carefully manage the PB1 pin to ensure the RF-Transmitter enters its power down state.
Rev. 1.00
6
March 1, 2010
www..com
HT46R01T3/HT48R01T3
Multi-chip Programming Considerations As MCU lines PB0 and PB1 are used to control the RF transmitter function, care must be taken to manage these lines correctly in the application program. As line PB1 is used to send data to the RF circuitry this line must be setup as an output. To avoid erroneous operation of the RF circuits this line should be setup as an output immediately after power-on. The PB0 pin on the MCU is used to receive synchronising pulses from the RF circuits and should therefore be setup as an input. As the MCU will be powered down independently of the RF Transmitter Peripheral Module, care must be taken to ensure that the MCU first clears its PB1 line to zero before powering down. This will allow the RF Transmitter Peripheral Module to enter its standby state and thus keep power consumption to a minimum.
Application Circuits
R2 3009 1 2 3 4 5 6 7 8 S e e N o te 2 47nH 1 8 p F (3 .9 p F ) V 150nF 1 5 p F (6 .8 p F ) 5 .6 p F (0 .5 p F ) 100pF OR S3 S2 S1 S0 P B 1 /D O U T P A 3 /IN T /A N 3 P A 2 /T M R 0 /A N 2 P A 1 /P F D /A N 1 P A 0 /A N 0 VSS VSS1 PAOUT PA4 PA5 PA6 PA7 VDD XOUT X IN VDD1 9 16 15 14 13 12 11 10 Y IC 9 8 4 3 7 5 (1 3 .5 6 0 )M H z 1 5 (1 8 )p F
DD
S4 S5 S6 V
DD
1 5 (1 8 )p F
Note:
1. 9.84375MHz crystal used for RF frequency of 315MHz 13.56MHz crystal used for RF frequency of 433.92MHz 2. The extra RC filter on the PAOUT pin can reduce second harmonics 3. The L and C values shown in brackets are for 433.92MHz
Rev. 1.00
7
March 1, 2010
www..com
HT46R01T3/HT48R01T3
Package Information
16-pin NSOP (150mil) Outline Dimensions
A 1
16 9 8
B
C C' G H D E F
=
* MS-012
Symbol A B C C D E F G H a Symbol A B C C D E F G H a
Dimensions in inch Min. 0.228 0.150 0.012 0.386 3/4 3/4 0.004 0.016 0.007 0 Nom. 3/4 3/4 3/4 3/4 3/4 0.050 3/4 3/4 3/4 3/4 Dimensions in mm Min. 5.79 3.81 0.30 9.80 3/4 3/4 0.10 0.41 0.18 0 Nom. 3/4 3/4 3/4 3/4 3/4 1.27 3/4 3/4 3/4 3/4 Max. 6.20 3.99 0.51 10.01 1.75 3/4 0.25 1.27 0.25 8 Max. 0.244 0.157 0.020 0.394 0.069 3/4 0.010 0.050 0.010 8
Rev. 1.00
8
March 1, 2010
www..com
HT46R01T3/HT48R01T3
Product Tape and Reel Specifications
Reel Dimensions
T2 D
A
B
C
T1
SOP 16N (150mil) Symbol A B C D T1 T2 Description Reel Outer Diameter Reel Inner Diameter Spindle Hole Diameter Key Slit Width Space Between Flange Reel Thickness Dimensions in mm 330.01.0 100.01.5 13.0
+0.5/-0.2
2.00.5 16.8
+0.3/-0.2
22.20.2
Rev. 1.00
9
March 1, 2010
www..com
HT46R01T3/HT48R01T3
Carrier Tape Dimensions
D
E F
P0
P1
t
W C
B0
D1
P A0
K0
R e e l H o le IC p a c k a g e p in 1 a n d th e r e e l h o le s a r e lo c a te d o n th e s a m e s id e .
SOP 16N (150mil) Symbol W P E F D D1 P0 P1 A0 B0 K0 t C Description Carrier Tape Width Cavity Pitch Perforation Position Cavity to Perforation (Width Direction) Perforation Diameter Cavity Hole Diameter Perforation Pitch Cavity to Perforation (Length Direction) Cavity Length Cavity Width Cavity Depth Carrier Tape Thickness Cover Tape Width Dimensions in mm 16.00.3 8.00.1 1.750.1 7.50.1 1.55 1.50
+0.10/-0.00 +0.25/-0.00
4.00.1 2.00.1 6.50.1 10.30.1 2.10.1 0.300.05 13.30.1
Rev. 1.00
10
March 1, 2010
www..com
HT46R01T3/HT48R01T3
Holtek Semiconductor Inc. (Headquarters) No.3, Creation Rd. II, Science Park, Hsinchu, Taiwan Tel: 886-3-563-1999 Fax: 886-3-563-1189 http://www.holtek.com.tw Holtek Semiconductor Inc. (Taipei Sales Office) 4F-2, No. 3-2, YuanQu St., Nankang Software Park, Taipei 115, Taiwan Tel: 886-2-2655-7070 Fax: 886-2-2655-7373 Fax: 886-2-2655-7383 (International sales hotline) Holtek Semiconductor Inc. (Shenzhen Sales Office) 5F, Unit A, Productivity Building, No.5 Gaoxin M 2nd Road, Nanshan District, Shenzhen, China 518057 Tel: 86-755-8616-9908, 86-755-8616-9308 Fax: 86-755-8616-9722 Holtek Semiconductor (USA), Inc. (North America Sales Office) 46729 Fremont Blvd., Fremont, CA 94538, USA Tel: 1-510-252-9880 Fax: 1-510-252-9885 http://www.holtek.com
Copyright O 2010 by HOLTEK SEMICONDUCTOR INC. The information appearing in this Data Sheet is believed to be accurate at the time of publication. However, Holtek assumes no responsibility arising from the use of the specifications described. The applications mentioned herein are used solely for the purpose of illustration and Holtek makes no warranty or representation that such applications will be suitable without further modification, nor recommends the use of its products for application that may present a risk to human life due to malfunction or otherwise. Holteks products are not authorized for use as critical components in life support devices or systems. Holtek reserves the right to alter its products without prior notification. For the most up-to-date information, please visit our web site at http://www.holtek.com.tw.
Rev. 1.00
11
March 1, 2010

▲Up To Search▲

Price & Availability of HT46R01T3

	To Download HT46R01T3 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .